KSLid F60 flux paste is specially designed for repairing phone motherboards, BGA chips, and processors, based on a
high-purity rosin formula. The lead-free and halogen-free formula has a low corrosion level, helping to protect
precision components and circuit traces. Good soldering activity helps quickly remove oxide films,
improves alloy wetting, and reduces the risk of solder bridges or cold solder joints. The paste produces little smoke and has
low volatility, and residues after heating can be easily cleaned. The fine and uniform texture retains
moisture and does not dry quickly, making it suitable for frequent repair work.
Features:
- Net content: 60 g
- High-purity rosin formula
- Lead and halogen free
- Low corrosion level
- Suitable for phone motherboards, BGA chips, and processors
- Good soldering activity
- Reduces the risk of solder bridges and cold solder joints
- Low smoke and volatility
- Easy to clean residues
- Fine and uniform texture